Base materials: 0.5mil PI/13um ADH/1/3 OZRA copper + 0.2mm FR-4 + ASC-FB x 12 x DT1 + 1oz CU Cover-lay: 0.5mil PI/1mil ADH
Surface finish: ENIG
Minimum line width: 0.15mm
Minimum line space: 0.10mm
Outline cutting: we have laser capability in house then we can laser cut the circuits instead of hard die during prototype stage to save production time and building tooling for mass production